Based on the 4-inch/3-inch indium phosphide (InP) wafers and 6-inch/4-inch gallium arsenide (GaAs) wafer materials, AMSFAB provides a full range of foundry solutions for optoelectronic processes from epitaxy to manufacturing. The processes cover zinc diffusion, butt-joint growth, multiple epitaxy, electron beam lithography, electron beam coating, ion implantation plus oxidation aperture and BCB process, etc. AMSFAB uses highly reliable processes to manufacture high-speed and high-sensitivity photodetectors (including PD, MPD and APD), edge emitters covering various bands (including FP, DFB and EML), and vertical-cavity surface-emitting lasers (VCSEL). These products are widely used in many fields such as communications, data centers, face recognition, fiber optic transmission, automotive radars, medicine and consumer electronics.

Photodetectors Process Platform

Edge Emitting Laser Process Platform

Vertical-Cavity Surface-Emitting Laser (VCSEL) Chip Process Platform

The vertical-cavity surface-emitting laser (VCSEL) is an optical emitter with a promising prospect. Initially used in optical communication, VCSEL has expanded its applications to various emerging optical sensing fields. AMSFAB’s VCSEL process platform can be divided into two process platforms, high-speed optical communication VCSEL devices, and VCSEL array devices. AMSFAB provides customized foundry services to customers in the fields of optical communication and optical sensing.

Epitaxial Process Platform